CIES Consortium

Industry-Academic Collaboration

Spintronics Embedded Device Technology

R& of ultra-small full-spin 3-D wireless semiconductor embedded substrate (SESUB) technologies featuring power saving

In 3D integration among IC chips with heterogeneous function, there is an urgent need for wireless communication because of downsizing, power saving, and low cost. In this research, we will develop the spintorque oscillator / receiver by using Nano-Contact Magnetoresistance device and transmission technology between oscillator and receiver for 3D-IC integration technology as wireless SESUB (Silicon Embedded Substrate) technology. The issues of this research development are to create the higher power / higher sensitivity spin-torque oscillator / receiver and to construct the low loss transmission system with electromagnetic resonance antenna. After solving these problems, we will actualize the full-spin wireless SESUB.