Tohoku University Center for Innovative Integrated Electoric Systems

Tohoku University

J-Innovation HUB
DAY 1 Sunday, March 24, 2019
International Symposium DAY 2 Monday, March 25, 2019
CIES Progress Report DAY 3 Tuesday, March 26, 2019
JST OPERA / ACCEL symposium ACCESS

5th CIES Technology Forum

DAY 1 (Sunday, March 24, 2019)   International Symposium

Program DL

Registration desk open at 9:45am

10:30-10:45 Opening remarks Tetsuo Endoh (Tohoku University)
10:45-11:30 Invited talk 1
Expectations for the spintronics memory in AI Computing systems		 Shigeki Tomishima (Intel)
11:30-12:15 Invited talk 2
Current status and future of embedded MRAM technology		 Shinhee Han (Samsung)
12:15-13:45 Lunch
13:45-14:30 Invited talk 3
Recent Developments and Next Directions for Embedded MRAM Technology		 William Gallagher (TSMC)
14:30-15:15 Invited talk 4
High-performance and high-endurance 128Mb-density STT-MRAM by an integration process development		 Hideo Sato (Tohoku University)
15:15-15:30 Break
15:30-16:15 Invited talk 5
Pathfinding for MRAM in the era of sub-10nm CMOS		 Seung H. Kang (Qualcomm)
16:15-17:00 Invited talk 6
Impact of MTJ-Based Nonvolatile Microcontroller LSI for IoT Applications		 Masanori Natsui (Tohoku University)
17:00-17:10 Closing remarks Shoji Ikeda (Tohoku University)
17:30-19:00 Banquet (Otemachi Sankei Plaza 3F)