5th CIES Technology Forum
DAY 2 (Monday, March 25, 2019) CIES Progress Report
Registration desk open at 9:15am
10:00-10:30 | Welcome address | Hideo Ohno (Tohoku Univ.) |
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Address | CAO | Akira Sudo (CAO) | |
Director-General, Science and Technology Policy Bureau, MEXT | Hiroki Matsuo (MEXT) | ||
Deputy Director-General, Industrial Science and Technology Policy and Environment Bureau, METI | Shoji Watanabe (METI) | ||
Director-General, 4th Patent Examination Department, JPO | Takashi Yamashita (JPO) | ||
10:30-11:10 | CIES Overview | Tetsuo Endoh (Tohoku Univ.) | |
11:10-11:50 | Industry-academic collaboration | ||
STT-MRAM aimed at developing non-volatile working memory and its manufacturing technologies | Tetsuo Endoh (Tohoku Univ.) | ||
11:50-13:20 | Lunch | ||
13:20-13:50 | Industry-academic collaboration | ||
Development of a Low-Power and High-Performance Edge AI Processor | Masanori Hariyama (Tohoku Univ.) | ||
13:50-14:20 | Industry-academic collaboration | ||
Embedded security technology | Koichi Ito (Tohoku Univ.) | ||
14:20-14:50 | Industry-academic collaboration | ||
Supersensitive magnetic sensors using ferromagnetic tunnel junctions | Yasuo Ando (Tohoku Univ.) | ||
14:50-15:10 | Break | ||
15:10-15:40 | JSPS Core-to-Core (Japan – UK – France) | ||
Creation of international research hub for innovative semiconductor materials and devices | Masaaki Niwa (Tohoku Univ.) | ||
15:40-16:00 | JST ACCEL | ||
Three-dimensional integrated circuits technology based on vertical BC-MOSFET and its advanced application exploration | Tetsuo Endoh (Tohoku Univ.) | ||
16:00-16:40 | CAO ImPACT | ||
Ohno implementation branch: Spintronics integrated circuit project | Tetsuo Endoh (Tohoku Univ.) | ||
16:40-17:00 | JST OPERA | ||
World-leading open innovation platform of fusion technologies bridged IT and transportation system areas | Tetsuo Endoh (Tohoku Univ.) | ||
17:00-17:20 | Community-based cooperation project | ||
Progress and prospect of CIES's Community-based cooperation project | Yasunobu Mizomoto (Tohoku Univ.) | ||
17:20-17:40 | CAO SIP | ||
R&D of ultra low power IoT devices and its technology platform with MTJ/CMOS hybrid technology for Society 5.0 | Tetsuo Endoh (Tohoku Univ.) | ||
17:40-17:50 | Closing remarks | Tetsuo Endoh (Tohoku Univ.) |