Tohoku University Center for Innovative Integrated Electoric Systems

Tohoku University

J-Innovation HUB

CIES Consortium

Industry-Academic Collaboration

Power Electronics Module Technology

R&D on assembly integration technology

  • Yoshikazu Takahashi Prof.
    Yoshikazu Takahashi
  • Tetsuo Endoh Prof.
    Tetsuo Endoh

In this research theme, industry and academia collaborate on research and development of assembly integration technologies to take advantage of the superior characteristics of new WBG devices such as GaN-on-Si and SiC. This contributes to reducing the size, weight, functionality, and performance of power electronics equipment.
We are developing the following technologies.

  1. Passive component technology
    Development of low loss / ultra-small reactor and transformer technology with low iron loss and copper loss even when driving at high frequencies, and development of capacitor technology that can withstand high temperatures of 250 degrees or higher.
  2. Power integrity technology and high heat dissipation layout technology
    Development of power integrity technology for various PCB substrates applied to high integration density power electronics circuits.
    Development of high heat dissipation layout technology that does not increase chip temperature at high frequency
  3. Bonding materials and technology
    Development of low thermal resistance and high reliability bonding materials and technology for assembling GaN on Si devices, gate circuits, and various passive components on insulating substrates and cooling structures.
R&D on assembly integration technology
R&D on assembly integration technology