Tohoku University Center for Innovative Integrated Electoric Systems

Tohoku University

J-Innovation HUB
DAY 1 Monday, March 23, 2020
CIES Progress Report
DAY 2 Tuesday, March 24, 2020
International Symposium

6th CIES Technology Forum

DAY 2 (Tuesday, March 24, 2020)   International Symposium

9:30-9:40 Opening remarks Tetsuo Endoh (Tohoku University)
9:40-10:20 Invited talk 1
The position of Spintronics Memories in High Speed AI Applications
Shigeki Tomishima (Intel)
10:20-11:00 Invited talk 2
MRAM and Spintronic Integrated Circuits: The Next Chapter and Innovations Needed
Seung H. Kang (Qualcomm)
11:00-11:40 Invited talk 3
STT-MRAM Technology Today and the Exciting Possible Roles for MRAM in Future LSI Hardware
Jon Slaughter (IBM)
11:40-12:20 Invited talk 4
STT-MRAM Technology beyond Mass Production
Shinhee Han (Samsung)
12:20-13:40 Lunch  
13:40-14:20 Invited talk 5
Materials Requirements of High-Speed and Low-Power Spin-Orbit-Torque Magnetic Random-Access Memory
Yen-Lin Huang (TSMC)
14:20-15:00 Invited talk 6
Recent Progress in Spintronics Devices for Next Generation MRAM
Hiroaki Honjo (Tohoku University)
15:00-15:20 Break
15:20-16:00 Invited talk 7
CAE & Measurement Solution for Power Electronics
Tomoaki Hara (Siemens)
16:00-16:40 Invited talk 8
The Latest Technical Trend of Power Devices
Naoto Fujishima (Fuji Electric)
16:40-17:20 Invited talk 9
Recent Development and Expectations for Power Electronics Technology in xEV
Satoshi Hashino (Keihin)
17:20-17:30 Closing remarks Shoji Ikeda (Tohoku University)