9th CIES Technology Forum
DAY 2 CIES Progress Report
Part 1 [Live] 9:00-12:10 (JST)
| 9:00-9:05 | Welcome address President, Tohoku Univ. | Hideo Ohno (Tohoku Univ.) |
| 9:05-9:35 | Address President, SEMI Japan | Masahiko (Jim) Hamajima (SEMI Japan) |
| Address Director-General, Research and Development Bureau, MEXT | Yoshiyuki Chihara (MEXT) | |
| Address Deputy Director-General, Industrial Science and Technology Policy and Environment Bureau, METI | Tetsuya Tanaka (METI) | |
| Address Director-General, Patent Examination Department (Electronic Technology), JPO | Soichi Yushina (JPO) | |
| 9:35-10:05 | CIES Overview | Tetsuo Endoh (Tohoku Univ.) |
| 10:05-10:25 | Industry-academic collaboration STT-MRAM Aimed at Developing Non-Volatile Working Memory and its Manufacturing Technologies |
Shoji Ikeda (Tohoku Univ.) |
| 10:25-10:45 | Industry-academic collaboration Embedded Security Technology |
Naofumi Homma (Tohoku Univ.) |
| 10:45-11:05 | Industry-academic collaboration Development of high-speed non-contact AI thermal camera for multi-personnel detection |
Tetsuo Endoh (Tohoku Univ.) |
| 11:05-11:20 | MEXT X-nics Innovative Spintronics X Semiconductor Research Hub |
Tetsuo Endoh (Tohoku Univ.) |
| 11:20-11:35 | NEDO AIC Design efficiency of AI processing semiconductors by CMOS/spintronics-hybrid technology and its applications |
Takahiro Hanyu (Tohoku Univ.) |
| 11:35-11:50 | JSPS Core-to-Core Spintronics/Vertical elements of two-dimensional materials |
Hiroshi Naganuma (Tohoku Univ.) |
| 11:50-12:05 | MEXT INNOPEL (Innovative Power Electronics Technologies) Integrated Power Electronics for the Realization of a Decarbonized Society |
Yoshikazu Takahashi (Tohoku Univ.) |
| 12:05-12:10 | Closing Remarks | Tetsuo Endoh (Tohoku Univ.) |
Part 2 [Streaming] 17:00-19:35 (JST)
| 17:00-17:30 | CIES Overview | Tetsuo Endoh (Tohoku Univ.) |
| 17:30-17:50 | Industry-academic collaboration STT-MRAM Aimed at Developing Non-Volatile Working Memory and its Manufacturing Technologies |
Shoji Ikeda (Tohoku Univ.) |
| 17:50-18:10 | Industry-academic collaboration Embedded Security Technology |
Naofumi Homma (Tohoku Univ.) |
| 18:10-18:30 | Industry-academic collaboration Development of high-speed non-contact AI thermal camera for multi-personnel detection |
Tetsuo Endoh (Tohoku Univ.) |
| 18:30-18:45 | MEXT X-nics Innovative Spintronics X Semiconductor Research Hub |
Tetsuo Endoh (Tohoku Univ.) |
| 18:45-19:00 | NEDO AIC CMOS/Design efficiency of AI processing semiconductors by CMOS/spintronics-hybrid technology and its applications |
Takahiro Hanyu (Tohoku Univ.) |
| 19:00-19:15 | JSPS Core-to-Core Spintronics/Vertical elements of two-dimensional materials |
Hiroshi Naganuma (Tohoku Univ.) |
| 19:15-19:30 | MEXT INNOPEL (Innovative Power Electronics Technologies) Integrated Power Electronics for the Realization of a Decarbonized Society |
Yoshikazu Takahashi (Tohoku Univ.) |
| 19:30-19:35 | Closing Remarks | Tetsuo Endoh (Tohoku Univ.) |