3rd CIES Technology Forum
DAY 1 (March 21, 2017)
Registration desk open at 9:45am
| 10:30-10:45 | Opening Remarks | Tetsuo Endoh (Tohoku University) |
| 10:45-11:25 | Invited talk 1 What’s Next for MRAM beyond Early Adopters? |
Seung H. Kang (Qualcomm) |
| 11:25-12:05 | Invited talk 2 Overview and challenge of current embedded STT-MRAM technology |
Yoonjong Song (Samsung) |
| 12:05-12:45 | Invited talk 3 Material development in advanced STT-MRAM for non-volatile VLSI |
Hiroaki Honjo (Tohoku University) |
| 12:45-14:20 | Lunch | |
| 14:20-15:00 | Invited talk 4 How Future Embedded Mobility Meets IT - Embedded cyber-physical system designs revisit semiconductor technology - |
Hideto Hidaka (Renesas Electronics) |
| 15:00-15:40 | Invited talk 5 eMRAM: The march to manufacturing |
David Eggleston (GLOBALFOUNDRIES) |
| 15:40-16:00 | Break | |
| 16:00-16:40 | Invited talk 6 GaN-based HEMT Technology for Low-loss and High-voltage Operation |
Masaaki Kuzuhara (Fukui University) |
| 16:40-17:20 | Invited talk 7 Recent Progress in GaN Power Devices |
Tetsuzo Ueda (Panasonic) |
| 17:20-17:30 | Closing Remarks | Shoji Ikeda (Tohoku University) |
| 18:00-19:30 | Banquet (Station Conference Tokyo, Sapia Tower 4F, 402ABCD) | |