10th CIES Technology Forum
DAY 2 International Symposium
Part 1 [Live] 9:00-12:35 (JST)
JST | PDT | CET | |
---|---|---|---|
9:00-9:15 | March 17 17:00-17:15 |
1:00-1:15 | Opening remarks Tetsuo Endoh (Tohoku Univ.) |
9:15-9:40 | 17:15-17:40 | 1:15-1:40 | Invited talk 1 Spintronics: From Physics, Through Memory, to Future Computing Hideo Ohno (Tohoku Univ.) |
9:40-10:05 | 17:40-18:05 | 1:40-2:05 | Invited talk 2 Semiconductor Systems for AI: Co-Optimization for Energy Efficiency and System Scalability Seung H. Kang (Adeia) |
10:05-10:30 | 18:05-18:30 | 2:05-2:30 | Invited talk 3 Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era Yasumitsu Orii (Rapidus) |
10:30-10:55 | 18:30-18:55 | 2:30-2:55 | Invited talk 4 IOWN and Photonics Electronics Convergence Devices Jun Terada (NTT) |
10:55-11:20 | 18:55-19:20 | 2:55-3:20 | Invited talk 5 NanoTerasu: A Catalyst for Science and Innovation Daichi Chiba (SRIS) |
11:20-11:45 | 19:20-19:45 | 3:20-3:45 | Invited talk 6 Technological Trends in Power Supply Systems for Data Centers Yasuhiro Okuma (Fuji Electric) |
11:45-12:10 | 19:45-20:10 | 3:45-4:10 | Invited talk 7 Novel 99+% Efficiency Datacenter Power Supplies Based on Bidirectional/Bipolar Power Transistors Johann W. Kolar (ETH Zurich) |
12:10-12:30 | 20:10-20:30 | 4:10-4:30 | Invited talk 8 Latest power module technology for EV/HEV being developed at Tohoku University CIES Yoshikazu Takahashi (Tohoku Univ.) |
12:30-12:35 | 20:30-20:35 | 4:30-4:35 | Closing remarks Tetsuo Endoh (Tohoku Univ.) |
Part 2 [Streaming] 17:00-20:35 (JST)
JST | PDT | CET | |
---|---|---|---|
17:00-17:15 | 1:00-1:15 | 9:00-9:15 | Opening remarks Tetsuo Endoh (Tohoku Univ.) |
17:15-17:40 | 1:15-1:40 | 9:15-9:40 | Invited talk 1 Spintronics: From Physics, Through Memory, to Future Computing Hideo Ohno (Tohoku Univ.) |
17:40-18:05 | 1:40-2:05 | 9:40-10:05 | Invited talk 2 Semiconductor Systems for AI: Co-Optimization for Energy Efficiency and System Scalability Seung H. Kang (Adeia) |
18:05-18:30 | 2:05-2:30 | 10:05-10:30 | Invited talk 3 Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era Yasumitsu Orii (Rapidus) |
18:30-18:55 | 2:30-2:55 | 10:30-10:55 | Invited talk 4 IOWN and Photonics Electronics Convergence Devices Jun Terada (NTT) |
18:55-19:20 | 2:55-3:20 | 10:55-11:20 | Invited talk 5 NanoTerasu: A Catalyst for Science and Innovation Daichi Chiba (SRIS) |
19:20-19:55 | 3:20-3:55 | 11:20-11:55 | Invited talk 6 Technological Trends in Power Supply Systems for Data Centers Yasuhiro Okuma (Fuji Electric) |
19:55-20:10 | 3:55-4:10 | 11:55-12:10 | Invited talk 7 Novel 99+% Efficiency Datacenter Power Supplies Based on Bidirectional/Bipolar Power Transistors Johann W. Kolar (ETH Zurich) |
20:10-20:30 | 4:10-4:30 | 12:10-12:30 | Invited talk 8 Latest power module technology for EV/HEV being developed at Tohoku University CIES Yoshikazu Takahashi (Tohoku Univ.) |
20:30-20:35 | 4:30-4:35 | 12:30-12:35 | Closing remarks Tetsuo Endoh (Tohoku Univ.) |