Overview
Evaluation Equipments for common use
Number | Equipment Name | Purpose | Wafer Size |
---|---|---|---|
1 | Scanning Transmission Type Electron Microscope(STEM) | Physical structure analysis | Chip |
2 | Focused Ion Beam Machining and Observation Apparatus(FIB) | Analysis sample machining | Chip |
3 | Scanning Electron Microscope(SEM) | Physical structure analysis | Chip |
4 | X-ray Photoelectron Spectroscopy(XPS) | Interface composition/ Chemical bond analysis |
Chip |
5 | X-ray Diffractometer(XRD) | Composition/Crystallinity/ Distorted stress analysis |
Chip |
6 | Ion Coater | Analysis sample processing | Chip |
7 | Micro Sampling Apparatus | Analysis sample processing | - |
8 | Draft Chamber | Analysis sample processing | - |
9 | Laser Marker | Analysis sample processing | 300mm |
10 | Spectroscopic Ellipsometer | Insulating thin film thickness measurement | 300mm |
11 | X-ray Fluorescence Analyzer(XRF) | Metal thin film thickness measurement | 300mm |
12 | Scanning Probe Microscope(SPM) | Surface morphology/Steps measurement | 300mm |
13 | Seat Resistance Measuring Instrument | Metal/Diffussion layer sheet resistance measurement | 300mm/FOUP Specification |
14 | MR Ratio Measuring Instrument | Magnetic Tunneling Junction sheet resistance measurement | 300mm |
15 | Vibrating Sample Magnetometer(VSM) | Magnetization curve measurement | Chip |
16 | Magnetic Torque Meter | Magnetic torque measurement | Chip |
17 | Optical Microscope | Visual inspection | 300mm |
18 | Wafer Surface Analyzer | Particle inspection | 300mm/FOUP Specification |
19 | Total Reflection X-rays Fluorescence Analyzer(TXRF) | Metal contamination inspection | 300mm/FOUP Specification |
20 | Chip Annealing Equipment | Anneal in the magnetic field | Chip |
21 | Measurement System for MTJ/Transistor Device |
Electrical Measurement, Semi-Automatic, -40~+200°C |
300mm |
22 | Measurement System for MTJ/Transistor Device |
Electrical Measurement, Semi-Automatic, RT~+200°C |
300mm |
23 | Measurement System for MTJ/Transistor Device | Electrical Measurement, Full-Automatic, -60~+200°C |
300mm/FOUP |
24 | Measurement System for MTJ Device with Magnetic Field Application Function |
Electrical & Magnetic Measurement, Manual, RT | 300mm |
25 | Measurement System for MTJ Device with Magnetic Field Application Function |
Electrical&Magnetic Measurement, Semi-Automatic, RT |
300mm |
26 | Measurement System for MTJ/Transistor Device ~ LSI Chip |
Electrical Measurement, Manual, RT~+300°C | 300mm |
27 | Memory LSI Test System | Memory LSI Function&Evaluation Test, Full-Automatic, RT~+150°C |
300mm/FOUP |
28 | High voltage measurement system for power devices | Electrical measurement for power devices, Manual, RT~+300℃ |
150mm |