東北大学 国際集積エレクトロニクス研究開発センター

東北大学

DAY 1 (2018年3月22日)
国際シンポジウム
DAY 2 (2018年3月23日)
CIES成果報告会

4th CIES Technology Forum

DAY 1 (2018年3月22日)

Registration desk open at 9:45am

10:30-10:45 Opening remarks Tetsuo Endoh
(Tohoku University)
10:45-11:30 Invited talk 1
STT-MRAM Embedded Technology in 28-nm FDSOI Logic Process for Mass-Production
Yong Kyu Lee
(Samsung)
11:30-12:15 Invited talk 2
eMRAM: Winning the IoT and AI Applications
David Eggleston
(GLOBALFOUNDRIES)
12:15-13:45 Lunch
13:45-14:30 Invited talk 3
Solution Challenges for IoT Society and Device Technology to Realize It
Kazuhiro Ohnishi
(Renesas Electronics)
14:30-15:15 Invited talk 4
Spintronics Nanoelectronics
- Faster, Smarter, and Smaller -
Hideo Ohno
(Tohoku University)
15:15-15:30 Break
15:30-16:15 Invited talk 5
Evolution of Power Electronics and Expectations for WBG Power Semiconductor
Naoya Eguchi
(Fuji Electric)
16:15-17:00 Invited talk 6
Advanced Power Module Technology
- Interface between Power Electronics and Power Devices -
Yoshikazu Takahashi
(Tohoku University)
17:00-17:10 Closing Remarks Shoji Ikeda
(Tohoku University)
17:30-19:00 Banquet (Station Conference Tokyo, Sapia Tower 5F)