東北大学 国際集積エレクトロニクス研究開発センター

東北大学

CIES Power Electronics Forum

CIES Seminar (2nd CIES Power Electronics Forum)
Program

January 15, 2018: Station Conference Tokyo, Sapia Tower 6F

9:00-9:30 Registration
9:30-9:40 Welcome and opening addresses
  Tetsuo Endoh, Tohoku University
9:45-11:50 S1: Electrification of Automobiles
9:45-10:20 Power Electronics Development in Europe – The Role of ECPE–
Leo Lorenz,European, Power Electronics Center
10:20-10:55 Application of Power Electronics Technology to Two-Motor Hybrid system
Satoshi Hashino, Keihin Corporation
10:55-11:30 SiC MOSFET – Design trade off in automotive application
Mark Muenzer, Infineon technologies
11:30-11:50 Advanced power module technology for WBG devices
Yoshikazu Takahashi, Tohoku University
11:50-13:10 Lunch
13:10-15:15 S2: Power Device Packaging
13:10-13:45 GaN-on-Si Power Devices
Tetsuzo Ueda, Automotive & Industrial Systems Company Panasonic Corporation
13:45-14:20 Wide Band Gap – Incremental and disruptive Packaging Innovations
Jérôme TEYSSEYRE, On-Semiconductor
14:20-14:55 Power System in Package (PSiP): a low inductive packaging technology with multilayer ceramic substrate and integrated active cooling
Karsten Schmidt, Rogers Corporation
14:55-15:15 GaN power device technology
Tetsuya Suemitsu, Tohoku University
15:15-15:45 Coffee Break
15:45-17:50 S3: Industry and electric power systems
15:45-16:20 Recent Topics of Industry Power Electronics
Akio Toba, Fuji Electric Co., Ltd.
16:20-16:55 DER aggregation for integration of variable renewable generation
Hiroshi Asano, Central research institute of Electric Power Industry
16:55-17:30 Trend and technical challenges to realize large integration of renewables into Japanese grid
Tomomichi Ito, Hitachi, Ltd.
17:30-17:50 Our R&D about Power Electronics for Power grids
Shuji Katoh Tohoku University.
17:50-18:00 Closing Remarks
  Tetsuo Endoh, Tohoku University

Arranging: Prof. Yoshikazu Takahashi

Access

Station Conference Tokyo, Sapia Tower 6F
1-7-12 Marunouchi, Chiyoda-ku, Tokyo

Station Conference Tokyo, Sapia Tower 6F

Photo Gallery

Prof. Tetsuo Endoh: (Tohoku Univ.)

Prof. Tetsuo Endoh (Tohoku Univ.)

Prof. Dr. Leo Lorenz (European Power Electronics Center)

Prof. Dr. Leo Lorenz (European Power Electronics Center)

Dr. Satoshi Hashino (Keihin Corporation)

Dr. Satoshi Hashino (Keihin Corporation)

Dr. Mark Muenzer (Infineon technologies)

Dr. Mark Muenzer (Infineon technologies)

Prof. Yoshikazu Takahashi (Tohoku Univ.)

Prof. Yoshikazu Takahashi (Tohoku Univ.)

Dr. Tetsuzo Ueda Automotive & Industrial Systems Company Panasonic Corporation

Dr. Tetsuzo Ueda Automotive & Industrial Systems Company Panasonic Corporation

Mr. Jérôme TEYSSEYRE (On-Semiconductor)

Mr. Jérôme TEYSSEYRE (On-Semiconductor)

Olivier Mathieu (Rogers Corporation)

Olivier Mathieu (Rogers Corporation)

Prof. Tetsuya Suemitsu(Tohoku Univ.)

Prof. Tetsuya Suemitsu(Tohoku Univ.)

Dr. Akio Toba (Fuji Electric Co., Ltd.)

Dr. Akio Toba (Fuji Electric Co., Ltd.)

Dr. Prof. Hiroshi Asano (Central research institute of Electric Power Industry)

Dr. Prof. Hiroshi Asano (Central research institute of Electric Power Industry)

Mr. Tomomichi Ito (Hitachi, Ltd.)

Mr. Tomomichi Ito (Hitachi, Ltd.)

Assoc. Prof. Shuji Katoh (Tohoku Univ.)

Assoc. Prof. Shuji Katoh (Tohoku Univ.)


Group photo

Group photo

Group photo

Group photo