東北大学 国際集積エレクトロニクス研究開発センター

東北大学

CIES Power Electronics Forum

CIES Seminar (2nd CIES Power Electronics Forum)
Program

January 15, 2019: Station Conference Tokyo, Sapia Tower 6F

9:00-9:30 Registration
9:30-9:40 Welcome and opening addresses
  Tetsuo Endoh, Tohoku University
9:45-11:50 S1: Electrification of Automobiles
9:45-10:20 Power Electronics Development in Europe – The Role of ECPE–
Leo Lorenz,European, Power Electronics Center
10:20-10:55 Application of Power Electronics Technology to Two-Motor Hybrid system
Satoshi Hashino, Keihin Corporation
10:55-11:30 SiC MOSFET – Design trade off in automotive application
Mark Muenzer, Infineon technologies
11:30-11:50 Advanced power module technology for WBG devices
Yoshikazu Takahashi, Tohoku University
11:50-13:10 Lunch
13:10-15:15 S2: Power Device, Packaging
13:10-13:45 GaN-on-Si Power Devices
Tetsuzo Ueda, Automotive & Industrial Systems Company Panasonic Corporation
13:45-14:20 Wide Band Gap – Incremental and disruptive Packaging Innovations
Jérôme TEYSSEYRE, On-Semiconductor
14:20-14:55 Power System in Package (PSiP): a low inductive packaging technology with multilayer ceramic substrate and integrated active cooling
Karsten Schmidt, Rogers Corporation
14:55-15:15 GaN power device technology
Tetsuya Suemitsu, Tohoku University
15:15-15:45 Coffee Break
15:45-17:50 S3: Industry and electric power systems
15:45-16:20 Recent Topics of Industry Power Electronics
Akio Toba, Fuji Electric Co., Ltd.
16:20-16:55 DER aggregation for integration of variable renewable generation
Hiroshi Asano, Central research institute of Electric Power Industry
16:55-17:30 Trend and technical challenges to realize large integration of renewables into Japanese grid
Tomomichi Ito, Hitachi, Ltd.
17:30-17:50 Our R&D about Power Electronics for Power grids
Shuji Katoh Tohoku University.
17:50-18:00 Closing Remarks
  Tetsuo Endoh, Tohoku University

Arranging: Prof. Yoshikazu Takahashi

Access

Station Conference Tokyo, Sapia Tower 6F
1-7-12 Marunouchi, Chiyoda-ku, Tokyo

Station Conference Tokyo, Sapia Tower 6F