東北大学 国際集積エレクトロニクス研究開発センター

東北大学

地域オープンイノベーション拠点

2021 Spintronics Workshop on LSI

General Information

The 2021 Spintronics Workshop on LSI will be held virtually on June 13, 2021, celebrating its 10th anniversary, in conjunction with the VLSI Symposium on Technology as a Satellite Workshop of the 2021 VLSI Symposia. The workshop will focus on spintronics-based LSI technologies for high performance and ultra low power systems. Papers on current status, prospects and the remaining challenges in this field will be presented from invited speakers.
The workshop is organized by Center for Innovative Integrated Electronic Systems (CIES), Research Instituite of Electrical Communication (RIEC), Center for Science and Innovation in Spintronics (CSIS) as World-Leading Research Center for Spintronics at Tohoku University, and Center for Spintronics Research Network (CSRN), Tohoku University.

Live Session: June 13, 15:00-17:00 (JST)

Video pre-recorded presentations on-demand are available until August 31.

It is free to watch the videos, but the registration is required. Please note that the registration deadline is July 31st.

Photo Gallery

Circular

15:00-15:10 Opening remarks Tetsuo Endoh (Tohoku Univ.)
15:10-15:20* Invited Talk 1 Hideo Ohno (Tohoku Univ.)
Spintronics - a Gateway to Green Society
15:20-15:30* Invited Talk 2 Shigeki Tomishima (Intel)
The Positioning of Spintronics Memories in the Modern Computer Systems
15:30-15:40* Invited Talk 3 Shy-Jay Lin (TSMC)
Novel Materials for Low-Power and Field-Free Spin-Orbit-Torque Magnetic Random-Access Memory
15:40-15:50* Invited Talk 4 Jongmin Lee (Samsung Electronics)
Recent Advances in STT-MRAM technology
15:50-16:00* Invited Talk 5 Seung H. Kang (Qualcomm)
The Next Chapter for MRAM: Re-Aiming for Advanced Logic Systems
16:00-17:00 Panel Discussion Moderator: Tetsuo Endoh (Tohoku Univ.)

*Estimated time allocation: Overview (5min), Q&A (5min)

Registration

The workshop fee is free of charge, but registration is required. The registration opens until July 31

Registration

Committee

Program Chair
Tetsuo Endoh Tohoku Univ.
Program Committee
Tadahiro Kuroda (Univ. of Tokyo, JSAP Executive Committee Chair of 2021 Symposia on VLSI Technology and Circuits)
H. S. Philip Wong (Stanford Univ., TSMC, IEEE Executive Committee Chair of 2021 Symposia on VLSI Technology and Circuits)
Shoji Ikeda (Tohoku Univ.)
Takahiro Hanyu (Tohoku Univ.)
Secretariat
Takahiro Shinada (Tohoku Univ.)
support‐office@cies.tohoku.ac.jp
Local arrangement
Secretariat for VLSI Symposia (Japan and Asia), c/o JTB Communication Design, Inc.
E‐mail: vlsisymp@jtbcom.co.jp

Past Spintronics Workshop on LSI