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CIES Consortium
CIES Consortium
Industry-Academic Collaboration
National Projects
Community-based Cooperation Projects
CIES Joint Research
Industry-Academic Collaboration
STT-MRAM and its manufacturing process technologies
Automatic design for non-volatile LSI
Supersensitive magnetic sensors
3D wireless SESUB
2D/3D integrated image processing
Embedded security system
Real-world intelligent system
National Projects
JST ACCEL
Three-dimensional integrated circuits technology based on vertical BC-MOSFET and its advanced application exploration
JST OPERA
World-leading open innovation platform of fusion technologies bridged IT and transportation system areas
CSTI ImPACT
Spintronics integrated circuit project
JSPS Core-to-Core
Controlled interfacing of 2D materials for integrated device technology
NEDO
R&D of GaN bidirectional power converter
NEDO
Development of evaluation equipment for magnetic and electrical properties of MRAM development and its shipping inspection
Community-based Cooperation Projects
CIES Joint Research
Integrated circuit implementation of recurrent neural networks for high-dimensional time-series data processing
Study on control of magnetization dynamics in magnetic ultra-thin films with magnetostricition
Application of Radiation Monte Carlo Simulations for Reliable Spintronics
Joint research between industry and academia on regional cooperation and utilization of patent information and patent system
Tohoku University,
Center for Innovative Integrated Electronic Systems
468-1 Aramaki Aza Aoba,
Aoba-ku, Sendai, Miyagi
980-0845, JAPAN
TEL +81-22-796-3410
FAX +81-22-796-3432
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